ICP Computec > ASEM > Book Mounting IPCs > BM3300
Ubiquity Inside
cULus Listed / CE
Asem Standards

BM3300 Series

  • Fanless Book Mounting IPC (0-50°C operating temperature)
  •               – Compact dimensions
  •  – Cabling from top
  •  – Front access to signalling, interfaces and extractable devices
  • ASEM UBIQUITY Basic Win32/64 runtime included
  • Intel® Skylake U 15W dual core processors
  • 1 x SODIMM DDR4 RAM system memory expandable up to 16GB
  • On top interfaces
  • – 3 x Ethernet 10/100/1000 Mbps
  • – 2 x USB 3.0
  • – 1 x DVI-D or 1 x Remote Video link (DVI-D and USB 2.0 up to 100 m)
  • – Serial and USB add-on boards (optional)
  • Front access
  • – Signalling LEDs and control buttons
  • – 1 x CFast Memory Card slot
  • – 1 x system battery removable
  • – 1 x USB 3.0
  • Mass storage 1 x CFast Memory Card Memory Card, 1 x mSATA SSD and 1 x 2.5” HDD/SSD with SATA III interfaces
  • DVI-D video output
  • Optional integrated RVL (Remote Video Link) video output for remotation of DVI-D and USB 2.0 signals up to 100 m
  • Isolated 24V DC power supply input and optionally UPS with external battery pack

Remotation System Information

BM3300 Series

The Book Mounting fanless IPC BM3300 is based on sixth generation Celeron, Core™ i3, i5 and i7 dual core 15W processors of the Intel® Skylake™ U platform, while the BM3500 family is based on the 7th generation Core i3,i5,i7 and Celeron dual-core 15W processors of the Intel Kaby Lake ™ U Platform, and both use the same motherboard.

BM3300 and BM3500 systems are supplied with a sturdy aluminium chassis, highly refined in every aesthetic and ergonomic detail.

The “all in one” motherboard provides, on top, three Ethernet 10/100/1000Mbps ports that support “Jumbo Frame” and “Wake on Lan” functionalities, two USB 3.0 ports, one DVI-D video output or, as an alternative, a Remote Video Link connector (RJ45) for the remotation of the video and USB signals up to 100 m; on front, a USB 3.0 port, a SATA III CFast slot, a slot for the extractable system battery and the signalling LEDs. The motherboard has also an mSATA connector for a SATA III SSD, one SATA III connector for a 2.5″ SSD/ HDD, up to 16 GB RAM with one DDR4 SODIMM module and an internal connector for additional serial or USB interfaces.

BM3300 & BM3500 systems have an isolated 24 VDC power supply input and an optional integrated UPS with external battery pack.


  BM3300 BM3300 RVL
 PROCESSOR Intel® Celeron® G3955U 2.00GHz 64 bit, 2 cores / 2 threads, 2MB Smart cache, soldered
Intel® Core i3-6100U 2.30GHz 64 bit, 2 cores / 4 threads, 3MB Smart cache, soldered
Intel® Core i5-6300U 2.40GHz (3.00GHz Turbo) 64 bit, 2 cores / 4 threads, 3MB Smart cache, soldered
Intel® Core i7-6600U 2.60GHz (3.40GHz Turbo) 64 bit, 2 cores / 4 threads, 4MB Smart cache, soldered

Intel® HD Graphics 510 integrated in Celeron 3955U processor, 300MHz/900MHz,
Intel® HD Graphics 520 integrated in Core processors, 300MHz/1GHz-1.05GHz,
DirectX 12 and OpenGL 4.4 support

 SYSTEM MEMORY -  RAM 4GB or 8GB or 16GB (1 x SODIMM DDR4 module)
 TPM TPM module (optional)
 MASS STORAGE 1 bootable CFast SATA III slot on board with external access (front)
1 x SSD or 1 x HDD 2,5" SATA III
 LAN 3 x LAN 10/100/1000Mbps (2 x Intel® I210, 1 x Intel® I219LM)
 USB 1 x USB 3.0 (Type-A, front)
2 x USB 3.0 (Type-A, top)
 BATTERY 1 x CR2032 Removable (front)

1 x RJ45 (top) intergrated Remote Video Link output (DVI-D and USB 2.0 signals remotation up to 100 m)

 ADD-ON  INTERFACES 1 x RS232/422/485 (DB15M) + 1 x USB 2.0
1 x RS232/422/485 (DB15M) isolated + 1 x USB 2.0
2 x RS232 (DB9M)
2 x USB 2.0
24VDC isolated with UPS with external battery pack (optional)
 CASE Installation For book mounting
 material Alluminium alloy 6082/5754/5056
 O.S. CERTIFIED Microsoft Windows 10 IoT Enterprise 2016 32/64bit, Microsoft Windows 8.1 Industry Pro 32/64bit, Microsoft Windows 7 Pro/Ultimate 32/64bit, Microsoft Windows Embedded Standard 7E/7P 32/64 bit, Linux
0°- 45°C with HDD 24x7
 APPROVALS CE, cULus LISTED (61010) pending


BM3300 Series Overview

BM3300 Series Datasheet



BM3300 Configurator


Alu: aluminium | INOX: Stainless steel true flat | Plastic: Plastic with Polycarbonate | Desk: desktop mount | WALL: wall mount | DIN RAIL: DIN rail mounting | VESA: 75/100 VESA compatible
| ROLEC: Taraplus compatible | RITTAL : CP-S series compatible | PXA: Intel® PXA270 | LX800: Geode LX800 | ATOM: Intel®ATOM Z5XXP | Cel: Intel®Celeron | CelM: Intel® Celeron M |
P: Intel® Pentium | PM: Intel® Pentium M | P4: Intel® Pentium 4 | C2D: Intel® Core 2 Duo | C2Q: Intel® Core 2 Quad | MiniPCI: MiniPCI bus | PC/104plus: PC/104Blus bus,PCI compatible |
PCI: PCI bus | PCIe: PCI Express bus | AGP: AGP bus | UPS: uninterruptible power supply. | RID: redundant power supply | CE5: Microsoft® Windows CE 5.0 | CE6: Microsoft® Windows CE
6.0 | WES: Microsoft® Windows Embedded Standard | XP Pro: Microsoft® Windows XP PRO Sp3 | W7: Microsoft® Windows Seven Professional FES 32/64bit | Res 4: 4-wire resistive touch
screen | Res 5: 5-wire resistive touch screen | GFG: Glass Film Glass touch screen